Nanofabrication Packaging | Temp-Team DK | Kgs. Lyngby Skip to content

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Forskning/Udvikling

Industri/Produktion

NY

Nanofabrication Packaging

Temp-Team

Kgs. Lyngby
Ansøg senest 01.11.2025
Fastansættelse

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About the job
We are looking for a Nanofabrication Packaging Technician for our client’s brand new, state-of-the-art, semiconductor and fabrication laboratory in Kongens Lyngby. The lab is among the most advanced in Europe and you get to work with cutting-edge technology in a highly dynamic environment of scientists, researchers and engineers trying to push the boundaries of technology.

Responsibility will include executing packaging processes (die-bonding, wire-bonding, components testing and inspections) adapted to the unique requirements of next generation devices.

You will be working with a diverse team of engineers, scientists and technicians on assembling and scaling complex next-generation devices. The role will have focus on hands-on operation.


Responsibilities

  • Execution of packaging procedures such as die bonding, wire bonding, and flip chip
  • Participating in daily planning and coordination of packaging activities.
  • Components testing and inspections
  • Documentation (MES logging SOP)
  • Electrical Measurements
  • Quality Assurance
  • Operating Microscopes
  • Continuously help improve the service quality and efficiency

Qualifications 
  • Experience with packaging processes and tools (wire bonding, die bonding, dispense, flip chip bonding, ... )
  • Good electrical, mechanical and technical understanding – with hands-on experience - Maybe you are a recent BSc or MSc graduate in electrical or mechanical engineering, or related fields) You can also be a graduate from a Technical School or have relevant industry/manufacturing experience
  • Good hand-eye coordination (experience with soldering could be a benefit)
  • Self-motivated to take personal ownership and deliver results while working in a highly challenging environment
  • Capability to systematically solve problems
  • Fluent oral & written communication skills in English
  • Excellent collaboration and teamwork skills

Nice to have (not required)

  • Hands-on experience with semiconductor or chip packaging tools and processes
  • Hands-on experience with packaging of complex (optomechanical, MEMS, microwave, devices)
  • Cleanroom experience
  • Experience in statistical process controls
  • Experience in cryogenic materials

Practical information 
  • Permanent position
  • Location: Kongens Lyngby
  • Attractive working conditions - including pension, healthcare and dental insurance
  • One of the largest Semiconductor and Fabrication labs in Europe with cutting edge experimental facilities
  • Dynamic environment with a mix of both academic and industry research
  • Part of a highly ambitious program aiming to invent completely new technologies
  • Extensive onboarding and training
  • Work schedule is full time


Application

You will be employed by TEMP-TEAM Denmark in a permanent position and work full-time at our client’s location in Kongens Lyngby.

We are reviewing applications and inviting for interviews on an ongoing basis, so do not wait to send your application and CV. Please make sure to highlight your experience in coordination, process improvement, and relevant operational environments.

For any questions regarding the position, please contact Peter Flintholm Reiffenstein at pre@temp-team.dk


Apply
If you are interested, do not hesitate to send a short application along with your resume. Temp-Team A/S is responsible for this recruitment and all inquiries must be directed to Temp-Team.
Due to GDPR, we do not receive CVs and applications via email.

Temp-Team

Temp-Team A/S is a national recruitment and staffing agency with eight local departments in Denmark. We have 45 years of experience within staffing and cover a wide range of industries. We focus on delivering high quality and a close personal contact to candidates and clients. 

Temp-Team is a part of JuhlerGroup – an international group of recruitment agencies.


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